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Alliance signs MOU with VinaCapital and the National Innovation Center to promote semiconductor exchange and collaboration projects

Southeast-Asia Impact Alliance signed a memorandum of cooperation with VinaCapital and the National Innovation Center (NIC) on October 28th in Hanoi, Vietnam. High-ranking government representatives, including the Minister of Planning and Investment, the Minister of Foreign Affairs, and the Minister of Labor, were present at the signing ceremony.

In the future, Southeast-Asia Impact Alliance will actively promote cross-regional semiconductor exchange and collaboration, including initiatives for talent development in Vietnam, the establishment of an IC design center, and the creation of a domestic semiconductor incubator program, all aimed at assisting the government in building a semiconductor ecosystem.

The National Innovation Center signed a memorandum of cooperation with more than 40 domestic and international partners at a signing ceremony
Mr. Don Lam, the CEO of VinaCapital (left) and Mr.CY Huang, the founder of the Southeast-Asia Impact Alliance (center), and NIC signed a MOU
(Source:vnanet
Vietnamese Prime Minister Pham Minh Chinh is delivering speech at the ceremony
Mr. Nguyen Chi Dung, the Minister of Planning and Investment, is delivering a speech at the inauguration ceremony
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